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Complete Guide to Computer Parts in English (Các Bộ Phận Trên Máy Tính Bằng Tiếng Anh)

Building or understanding a computer requires knowledge of its essential components. This comprehensive guide covers all major computer parts in English (các bộ phận trên máy tính bằng tiếng Anh) with technical specifications, functions, and practical considerations for both beginners and advanced users.

1. Core Computer Components (Các thành phần chính)

1.1 Central Processing Unit (CPU – Bộ xử lý trung tâm)

The CPU is the “brain” of the computer, executing instructions and performing calculations. Modern CPUs contain multiple cores (typically 2-32) that handle parallel processing tasks.

  • Clock Speed: Measured in GHz (gigahertz), indicates how many cycles per second the CPU can perform
  • Cores/Threads: Physical cores vs. logical threads (hyper-threading allows 2 threads per core)
  • Cache Memory: L1 (fastest, smallest), L2, L3 (largest, slowest) cache levels
  • TDP (Thermal Design Power): Measures heat output in watts (e.g., 65W, 125W)
CPU Model Cores/Threads Base Clock Boost Clock TDP Socket
Intel Core i9-13900K 24/32 3.0GHz 5.8GHz 125W LGA 1700
AMD Ryzen 9 7950X3D 16/32 4.2GHz 5.7GHz 120W AM5
Intel Core i5-13600K 14/20 3.5GHz 5.1GHz 125W LGA 1700
AMD Ryzen 7 5800X3D 8/16 3.4GHz 4.5GHz 105W AM4

1.2 Graphics Processing Unit (GPU – Bộ xử lý đồ họa)

The GPU handles rendering images, videos, and animations. Critical for gaming, video editing, and 3D rendering. Modern GPUs have thousands of smaller cores optimized for parallel tasks.

  • VRAM: Dedicated video memory (e.g., 8GB GDDR6)
  • CUDA Cores (NVIDIA)/Stream Processors (AMD): Parallel processing units
  • Ray Tracing Cores: For realistic lighting effects
  • Tensor Cores: AI acceleration (DLSS/FSR)
  • TGP (Total Graphics Power): Power consumption under load

1.3 Random Access Memory (RAM – Bộ nhớ truy cập ngẫu nhiên)

Temporary memory that stores active data and applications. More RAM allows for better multitasking.

  • Capacity: Measured in GB (8GB, 16GB, 32GB, 64GB, 128GB)
  • Type: DDR4 (current standard), DDR5 (emerging)
  • Speed: Measured in MHz (e.g., 3200MHz, 3600MHz)
  • Latency: CL timing (e.g., CL16, CL18 – lower is better)
  • Channels: Single-channel vs. dual-channel (better performance)

1.4 Storage Devices

Hard Disk Drive (HDD – Ổ đĩa cứng): Traditional mechanical storage with spinning platters. Slower but cheaper per GB.

  • 7200 RPM (standard) vs. 5400 RPM (slower, cooler)
  • 3.5″ (desktop) vs. 2.5″ (laptop)
  • SATA interface (6Gb/s theoretical max)

Solid State Drive (SSD – Ổ đĩa thể rắn): Faster storage with no moving parts. Uses NAND flash memory.

  • SATA SSD: 2.5″ form factor, ~550MB/s speeds
  • NVMe SSD: M.2 form factor, PCIe interface (3000-7000MB/s)
  • QLC vs. TLC vs. MLC: Different NAND types affecting endurance
  • TBW (Terabytes Written): Drive endurance rating
Storage Type Capacity Interface Read Speed Write Speed Price per GB
HDD 3.5″ 1TB SATA III 180MB/s 180MB/s $0.03
SATA SSD 1TB SATA III 550MB/s 520MB/s $0.08
NVMe SSD (PCIe 3.0) 1TB PCIe 3.0 x4 3500MB/s 3000MB/s $0.10
NVMe SSD (PCIe 4.0) 1TB PCIe 4.0 x4 7000MB/s 5000MB/s $0.12
NVMe SSD (PCIe 5.0) 1TB PCIe 5.0 x4 12000MB/s 10000MB/s $0.20

2. Secondary Components (Các thành phần phụ)

2.1 Motherboard (Bo mạch chủ)

The main circuit board that connects all components. Determines compatibility and expansion options.

  • Form Factor: ATX (standard), Micro-ATX, Mini-ITX (small)
  • Chipset: Determines features (e.g., Intel Z790, AMD X670E)
  • Socket Type: Must match CPU (e.g., LGA1700, AM5)
  • RAM Slots: Typically 2 or 4 (dual-channel)
  • Expansion Slots: PCIe x16 (GPU), PCIe x1/x4 (other cards)
  • Storage Connectors: SATA ports, M.2 slots
  • I/O Ports: USB, audio, Ethernet, etc.

2.2 Power Supply Unit (PSU – Bộ nguồn)

Converts AC power to DC for computer components. Critical for system stability.

  • Wattage: Total power output (500W-1600W)
  • Efficiency Rating: 80 Plus (White, Bronze, Silver, Gold, Platinum, Titanium)
  • Modularity: Non-modular, semi-modular, fully modular
  • Form Factor: ATX (standard), SFX (small form factor)
  • Protection Features: OCP, OVP, UVP, SCP, OPP, OTP

Power Calculation Formula:

Recommended PSU Wattage = (CPU TDP + GPU TGP) × 1.5 + (Other Components × 0.3)

2.3 Computer Case (Vỏ máy tính)

Houses and protects components while providing airflow. Affects cooling performance and build aesthetics.

  • Form Factor: ATX (full-size), Micro-ATX, Mini-ITX
  • Airflow Design: Mesh front (better cooling) vs. solid front (quieter)
  • Cooling Support: Fan mounts, radiator clearance
  • Drive Bays: 3.5″ (HDD), 2.5″ (SSD) mounts
  • I/O Panel: Front panel connectors (USB, audio)
  • Cable Management: Space behind motherboard tray

2.4 Cooling Systems (Hệ thống làm mát)

Air Cooling: Uses heatsinks and fans. Most common and reliable.

  • Single-tower vs. dual-tower heatsinks
  • 92mm, 120mm, 140mm fan sizes
  • Push vs. pull configuration

Liquid Cooling: Uses liquid to transfer heat. More efficient but complex.

  • AIO (All-In-One): Pre-filled closed-loop systems (120mm, 240mm, 280mm, 360mm radiators)
  • Custom Loops: Individual components (pump, reservoir, radiator, blocks, tubing)
  • Thermal Paste: Conducts heat between CPU and cooler

3. Peripheral Devices (Thiết bị ngoại vi)

3.1 Input Devices

Keyboard (Bàn phím):

  • Switch Types: Membrane (quiet), mechanical (tactile), optical (fast)
  • Mechanical Switches: Cherry MX (Red, Brown, Blue), Gateron, Kailh
  • Layouts: Full-size (104 keys), TKL (87 keys), 60% (61 keys)
  • Backlighting: RGB, single-color, none

Mouse (Chuột):

  • Sensor Type: Optical (LED, laser), PMW3360, Hero 25K
  • DPI/CPI: Dots per inch (400-25600 DPI)
  • Polling Rate: Hz (125Hz, 500Hz, 1000Hz)
  • Grip Styles: Palm, claw, fingertip
  • Weight: Lightweight (<80g) vs. heavy (>100g)

3.2 Output Devices

Monitor (Màn hình):

  • Panel Types: TN (fast), IPS (color accurate), VA (high contrast), OLED (perfect blacks)
  • Resolution: Full HD (1920×1080), QHD (2560×1440), 4K (3840×2160), 5K (5120×2880)
  • Refresh Rate: 60Hz (standard), 144Hz, 240Hz, 360Hz (gaming)
  • Response Time: 1ms (TN), 4ms (IPS), measured in GTG (gray-to-gray)
  • Adaptive Sync: G-Sync (NVIDIA), FreeSync (AMD)
  • Color Gamut: sRGB (standard), Adobe RGB, DCI-P3 (wide color)

Printer (Máy in):

  • Types: Inkjet, laser, thermal, 3D
  • Resolution: DPI (dots per inch, e.g., 1200×1200 DPI)
  • Print Speed: PPM (pages per minute)
  • Connectivity: USB, Wi-Fi, Ethernet, cloud printing
  • Consumables: Ink cartridges (inkjet), toner (laser)

4. Advanced Components (Các thành phần nâng cao)

4.1 Sound Cards (Card âm thanh)

Dedicated audio processing for high-fidelity sound. Important for audiophiles and music production.

  • DAC (Digital-to-Analog Converter): 16-bit/44.1kHz (CD quality) to 32-bit/384kHz (high-res)
  • SNR (Signal-to-Noise Ratio): Measured in dB (higher is better, e.g., 120dB)
  • Outputs: 3.5mm jack, RCA, optical (TOSLINK), HDMI
  • Impedance: Ohms (Ω) rating for headphone outputs
  • Brand Examples: Creative Sound Blaster, ASUS Xonar, Focusrite

4.2 Network Interface Cards (NIC – Card mạng)

Handles network connectivity. Can be integrated or dedicated.

  • Wired: Ethernet (10/100/1000 Mbps, 2.5G, 5G, 10G)
  • Wireless: Wi-Fi standards (802.11ac/Wi-Fi 5, 802.11ax/Wi-Fi 6, Wi-Fi 6E)
  • Bluetooth: Versions 4.0, 5.0, 5.2 (LE Audio support)
  • Latency: Critical for gaming and real-time applications

4.3 Capture Cards (Card thu)

Used for recording or streaming gameplay and video content.

  • Types: Internal (PCIe), external (USB/Thunderbolt)
  • Resolution Support: 1080p60, 1440p60, 4K30, 4K60
  • Encoding: Hardware encoding (H.264, H.265/HEVC)
  • Passthrough: Zero-latency monitoring
  • Brand Examples: Elgato, AVerMedia, Magewell

5. Computer Assembly Guide (Hướng dẫn lắp ráp)

Building a computer involves these key steps:

  1. Prepare Workspace: Clean, static-free surface with proper tools (screwdrivers, anti-static wrist strap)
  2. Install CPU:
    • Lift the socket retention arm
    • Align CPU triangle marker with socket
    • Gently place CPU in socket (no force needed)
    • Secure the retention arm
  3. Install CPU Cooler:
    • Apply thermal paste (pea-sized dot)
    • Mount cooler according to manufacturer instructions
    • Connect fan to CPU_FAN header
  4. Install RAM:
    • Open clips on DIMM slots
    • Align notch and insert RAM firmly until clips snap
    • For dual-channel: Use slots 2 and 4 (or 1 and 3)
  5. Install Motherboard:
    • Place standoffs in case
    • Align I/O shield and motherboard
    • Secure with screws (don’t overtighten)
  6. Install Storage:
    • M.2 SSDs: Insert at angle, secure with screw
    • SATA SSDs/HDDs: Mount in drive bays, connect SATA and power
  7. Install GPU:
    • Remove case expansion slot covers
    • Align PCIe slot and press down firmly
    • Secure with screws to case
    • Connect PCIe power cables
  8. Install PSU:
    • Mount in case (fan facing down if case has vent)
    • Route cables neatly
    • Connect 24-pin motherboard, 8-pin CPU, and other components
  9. Connect Case Cables:
    • Power button, reset button, LEDs
    • USB 3.0/3.1 headers
    • Audio header
  10. Cable Management:
    • Use zip ties or Velcro straps
    • Route cables behind motherboard tray
    • Ensure no obstruction to airflow
  11. First Boot:
    • Connect monitor, keyboard, mouse
    • Power on and enter BIOS/UEFI (usually DEL or F2)
    • Check all components are recognized
    • Enable XMP/DOCP for RAM if needed
    • Set boot priority for OS installation

6. Maintenance and Upgrades (Bảo trì và nâng cấp)

6.1 Regular Maintenance

  • Dust Cleaning: Every 3-6 months with compressed air
  • Thermal Paste: Reapply every 2-3 years
  • Software Updates:
    • BIOS/UEFI updates (caution: can brick motherboard if interrupted)
    • GPU driver updates (NVIDIA GeForce Experience, AMD Adrenalin)
    • Chipset drivers
  • Storage Health:
    • Check SSD health with CrystalDiskInfo
    • Defragment HDDs (not needed for SSDs)
    • Monitor SMART data for drive failures
  • Temperature Monitoring:
    • Use HWMonitor, Core Temp, or GPU-Z
    • Ideal temps: CPU <80°C, GPU <85°C under load

6.2 Common Upgrades

CPU Upgrades:

  • Check motherboard socket compatibility
  • Verify BIOS supports new CPU
  • Consider cooling requirements (higher TDP may need better cooler)

GPU Upgrades:

  • Check PSU wattage (new GPUs often require more power)
  • Verify case clearance (length and width)
  • Consider bottleneck with current CPU

RAM Upgrades:

  • Match existing RAM specs (speed, timings, capacity)
  • Check motherboard QVL (Qualified Vendor List) for compatibility
  • For dual-channel: Install in pairs (2x8GB instead of 1x16GB)

Storage Upgrades:

  • Clone existing drive to new SSD using Macrium Reflect or Clonezilla
  • For NVMe: Check motherboard M.2 slot specifications (PCIe gen, length)
  • Consider RAID configurations for redundancy or performance

6.3 Troubleshooting Common Issues

Computer Won’t Turn On:

  • Check PSU switch and power cable
  • Verify front panel connectors
  • Test with minimal components (1 RAM stick, integrated graphics)
  • Check for loose cables or components

No Display/Video Output:

  • Reseat GPU and RAM
  • Try different display cables/ports
  • Test with integrated graphics (if CPU has iGPU)
  • Check monitor input source

Overheating:

  • Check fan curves in BIOS
  • Clean dust from heatsinks and fans
  • Reapply thermal paste
  • Verify proper airflow (intake/exhaust balance)
  • Monitor temps with software

BSOD (Blue Screen of Death):

  • Note the error code for diagnosis
  • Test RAM with MemTest86
  • Update all drivers
  • Check for disk errors (chkdsk)
  • Test with different components if possible

7. Future Trends in Computer Hardware (Xu hướng tương lai)

7.1 CPU Developments

  • Core Counts: Consumer CPUs approaching 32 cores
  • Efficiency Cores: Hybrid architectures (P-cores + E-cores)
  • Chiplet Design: Modular CPU design (AMD’s approach)
  • 3D Stacking: AMD’s 3D V-Cache technology
  • New Instructions: AVX-512, AMX for AI acceleration

7.2 GPU Advancements

  • Ray Tracing: More efficient implementations
  • Upscaling Technologies: DLSS 3 (NVIDIA), FSR 3 (AMD)
  • AI Acceleration: Dedicated AI cores for workloads
  • Memory: GDDR6X, HBM (High Bandwidth Memory)
  • Power Efficiency: Better performance per watt

7.3 Memory Technologies

  • DDR5 RAM: Higher speeds (4800MHz+), lower power consumption
  • LPDDR5X: For laptops and mobile devices
  • CXL (Compute Express Link): High-speed CPU-to-device interconnect
  • Storage-Class Memory: Bridging gap between RAM and storage

7.4 Storage Innovations

  • PCIe 5.0 SSDs: Speeds up to 14000MB/s
  • QLC NAND: Higher density, lower cost per GB
  • Optane Memory: Intel’s 3D XPoint technology (discontinued but influential)
  • Computational Storage: SSDs with built-in processing

7.5 Cooling Technologies

  • Phase-Change Cooling: Like refrigeration for extreme overclocking
  • Immersive Cooling: Submerging components in dielectric fluid
  • Graphene Heat Spreaders: Better heat conduction than copper
  • Vapor Chambers: More efficient than heat pipes

8. Authoritative Resources (Tài nguyên uy tín)

For further technical information about computer components in English, consult these authoritative sources:

For academic research on computer architecture:

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